• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    According to the present invention, the area of the multi-layer substrate is reduced, the size of the multilayer board can be reduced, and the oscillation frequency adjustment step can be reduced. To this end, in the present invention, the grounding conductor 7 is formed on almost the entire surface of the intermediate wiring layer 1h among the wiring layers 1g, 1h, and 1j of at least three adjacent layers, and is formed on one wiring layer lj adjacent to the intermediate wiring layer. While forming the first resonance line 9, the second resonance line 10 is formed in the other wiring layer lg adjacent to the intermediate wiring layer 1h to form the first resonance line 9 and the second resonance line. (10) was overlapped in the up-down direction.
    公开号:KR20000047619A
    申请号:KR1019990049860
    申请日:1999-11-11
    公开日:2000-07-25
    发明作者:나카노가즈히로
    申请人:가타오카 마사타카；알프스 덴키 가부시키가이샤；
    IPC主号:
    专利说明:

    Voltage Controlled Oscillators {VOLTAGE CONTROLLED OSCILLATOR}
    The present invention relates, for example, to a voltage controlled oscillator which is used in a transmission / reception unit for a cellular phone, which can be used in two cellular phone systems having different methods, and oscillates at different frequencies.
    A conventional voltage controlled oscillator will be described with reference to FIGS. 4 and 5. First, Fig. 4 is a cross-sectional view of the main portion, and the multilayer board 21 has, for example, three insulator layers 21a, 2lb, and 21c. The lower surface of the first insulator layer 21a (and thus the lower surface of the multilayer substrate 2l ') becomes the first wiring layer 2ld, and the space between the first insulator layer 2la and the second insulator layer 2lb is the second wiring layer. (2le), between the second insulator layer 21b and the third insulator layer 2lc is the third wiring layer 2lf, and the upper surface of the third insulator layer (thus the upper surface of the multilayer substrate 21) is the fourth It is a wiring layer 21g. These first wiring layers 21d to 4lg are layers for forming a conductor there.
    Ground conductors 23a and 23b and wiring conductors 23c and 23d as first circuit wiring conductors 23 for circuit wiring of the first oscillation circuit 22 in one region of the fourth wiring layer 21g. ) Is formed. First circuit components 22a, 22b, and 22c constituting the first oscillation circuit 22 are mounted and connected to the grounding conductors 23a and 23b and the wiring conductors 23c and 23d as appropriate.
    On the other hand, as the second circuit wiring conductor 25 for circuit wiring of the second oscillation circuit 24 in the other area of the fourth wiring layer 21g, the grounding conductors 25a and 25b and the wiring conductor 25c. , 25d) and the like. Second circuit components 24a, 24b, and 24c constituting the second oscillation circuit 24 are mounted and connected to the grounding conductors 25a and 25b and the wiring conductors 25c and 25d as appropriate.
    In the first wiring layer 21d of the multilayer board 21, a conductor (first grounding conductor) 26 grounded over the entire surface is provided. Among the two wiring layers 2le and 21f provided in the inner layer, the first microstrip line 27 and the second resonance which become the first resonance line are located in the second wiring layer 2le immediately above the first ground conductor 26. The 2nd microstrip line 28 used as a line is provided in parallel. In addition, a conductor (second ground conductor) 29 grounded over the entire surface is provided in the third wiring layer 2lf. As a result, the first microstrip line 27 and the second microstrip line 28 are fitted by the first ground conductor 26 and the second ground conductor 29.
    The first ground conductor 26 is connected to the second ground conductor 29 by a connecting conductor 30 formed on the side surface of the multilayer board 21 and at the same time, the ground of one of the first circuit wiring conductors 23 is grounded. One of the second circuit wiring conductors 25 is connected to the second ground conductor 29 by a connecting conductor 31 which is connected to the conductive conductor 23a and is similarly formed on the side end surface of the multilayer board 21. Is connected to the grounding conductor 25a. The second ground conductor 29 is connected to another grounding conductor 23b of the first circuit wiring conductor by a through hole 32 penetrating through the third insulator layer 2lc. Similarly, the third insulator layer 2lc is connected. The conductive hole 33 penetrates the other to connect to another grounding conductor 25b of the second circuit wiring conductor 25.
    FIG. 5 is a perspective view showing the configuration of the first microstrip line 27 and the second microstrip line 28 formed on the second wiring layer 21e, and is shown together with the first insulator layer 2la. The first microstrip line 27 and the second microstrip line 28 have an appropriate shape (for example, a c-shape), and end portions thereof are terminal portions 27a, 27b, 28a, and 28b.
    The first terminal portion 27a of the first microstrip line 27 is connected to one of the first circuit wiring conductors by a through hole 34 passing through the second insulator layer 21b and the third insulator layer 21c. Is connected to the wiring conductors 23c, and the second terminal portion 27b is connected to the second ground conductor 29 by a through hole 35 passing through the second insulator layer 2lb.
    Similarly, the second circuit wiring conductor 25 is formed by the through hole 36 through which the first terminal portion 28a of the second microstrip line 28 passes through the second insulator layer 21b and the third insulator layer 2lc. It is connected to one wiring conductor 25c, and the 2nd terminal part 28b is connected to the 2nd ground conductor 29 by the through hole 37 which penetrates the 2nd insulator layer 21b.
    The first microstrip line 27 forms the first oscillation circuit 22 together with the first circuit parts 23a, 23b, 23c, and the like. The second microstrip line 28 includes the second circuit parts 24a, Together with 24b, 24c, etc., the 2nd oscillation circuit 24 is comprised.
    In addition, the multi-layer substrate 2l includes the first circuit components 22a, 22b and 22c constituting the first oscillation circuit 22 and the second circuit components 24a, 24b and 24c constituting the second oscillation circuit 24. The metal cover 38 which covers and seals is provided.
    The first microstrip line 27 and the second microstrip line 28 together with the first ground conductor 26 and the first insulator layer 21a are irradiated by irradiating a laser beam from the lower surface side of the multilayer substrate 21. As shown by the dotted lines A and B of FIG. 5, the notch is inserted to adjust the inductance of the first microstrip line 27 and the inductance of the second microstrip line 28 to adjust the oscillation frequency of the first oscillation circuit 22. And the oscillation frequencies of the second oscillation circuit 24 are adjusted to be predetermined frequencies, respectively.
    However, in the conventional voltage controlled oscillator described above, since the first microstrip line 27 and the second microstrip line 28 are formed of the same second wiring layer 21e, the multilayer board 21 to be used is There is a problem that the area is large and the voltage controlled oscillator cannot be miniaturized.
    In addition, since the first microstrip line 27 and the second microstrip line 38 are formed at positions away from the plane, when adjusting the oscillation frequency of the first oscillation circuit 22, the first microstrip line 27 is provided. When trimming and adjusting the oscillation frequency of the second oscillation circuit 24, the second microstripline 28 must be trimmed, so that the trimming process for adjusting the oscillation frequency is another process. For this reason, there is a problem that an extra time is required for adjusting the oscillation frequency.
    Therefore, the voltage controlled oscillator of the present invention aims to reduce the size of the multilayer board and to reduce the oscillation frequency adjustment step.
    1 is a sectional view of an essential part of a voltage controlled oscillator of the present invention;
    2 is a perspective view showing the configuration of a first microstrip line and a second microstrip line in the voltage controlled oscillator of the present invention;
    3 is a plan view showing the configuration of a first microstrip line and a second microstrip line in the voltage controlled oscillator of the present invention;
    4 is a sectional view of an essential part of a conventional voltage controlled oscillator;
    Fig. 5 is a perspective view showing the configuration of a first microstrip line and a second microstrip line in a conventional voltage controlled oscillator.
    ※ Explanation of symbols for main parts of drawing
    1: multilayer substrate 1a: first insulator layer
    1b: second insulator layer 1c: third insulator layer
    1d: fourth insulator layer 1e: fifth insulator layer
    1f: first wiring layer 1g: second wiring layer
    1h: third wiring layer 1i: fourth wiring layer
    1j: fifth wiring layer 1k: sixth wiring layer
    2: first oscillation circuit 2a, 2b, 2c: first circuit component
    3: first circuit wiring conductor 3a, 3b: grounding conductor
    3c, 3d: Wiring conductor 4: Second oscillation circuit
    4a, 4b, 4c: second circuit component 5: second circuit wiring conductor
    5a, 5b: Grounding conductor 35, 5d: Wiring conductor
    6: first grounding conductor 7: second grounding conductor
    8: third grounding conductor
    9: first microstrip line (first resonant line)
    9a: 1st terminal part 9b: 2nd terminal part
    9c: Center track conductor 9d, 9e: Outside track conductor
    10: second microstrip line (second resonance line)
    10a: 1st terminal part 10b: 2nd terminal part
    10c: center track conductor 10d, 10e: outer track conductor
    11, 12: grounding conductor 13, 14, 15, 16, 17, 18: through hole
    41, 42: notch groove
    As a means for solving the above problems, the voltage controlled oscillator of the present invention includes a multilayer board having at least three adjacent wiring layers in an inner layer, circuit components provided on an upper surface of the multilayer board, and a resonance line formed in the wiring layer. And the circuit component has a first circuit component constituting a first oscillation circuit and a second circuit component constituting a second oscillation circuit, and the resonance line is the first oscillator circuit like the first circuit component. And a second resonance line constituting the second oscillation circuit like the first circuit and the second circuit component. The ground conductor is formed on a substantially entire surface of the wiring layer in the middle of the wiring layer, and the wiring layer in the middle is formed. The first resonant line is formed in one wiring layer adjacent to and the second resonant line is formed in the other wiring layer adjacent to the intermediate wiring layer. The first and the second resonance line and the first resonance line was overlap in the vertical direction.
    In the voltage controlled oscillator of the present invention, the first resonance line has a terminal portion connected to the first oscillation circuit, and the terminal portion does not overlap the second resonance line.
    The voltage controlled oscillator of the present invention has a terminal portion in which the second resonance line is connected to the second oscillation circuit, and the terminal portion does not overlap the first resonance line.
    In addition, the voltage controlled oscillator of the present invention makes the oscillation frequency of the first oscillation circuit higher than the oscillation frequency of the second oscillation circuit, so that the first oscillation frequency is opposite to the upper surface side of the multilayer board with respect to the first resonance line. 2 resonant lines were installed.
    The voltage controlled oscillator of the present invention will be described with reference to FIGS. First, Fig. 1 is a cross-sectional view of an essential part, and the multilayer board 1 has, for example, five insulator layers 1a, 1b, 1c, ld and 1e. The lower surface of the first insulator layer 1a (thus the lower surface of the multilayer substrate l) becomes the first wiring layer 1f, and the second wiring layer (between the first insulator layer la and the second insulator layer 1b). 1g), between the second insulator layer lb and the third insulator layer 1c becomes the third wiring layer 1h, and between the third insulator layer lc and the fourth insulator layer 1d. The fourth wiring layer 1i becomes the fifth wiring layer lj between the fourth insulator layer 1d and the fifth insulator layer le, and thus the upper surface of the fifth insulator layer 1e (thus the multilayer substrate 1). The upper surface of the layer 1 is a sixth wiring layer 1k. These 1st wiring layer 1f thru | or 6th wiring layer 1k are layers for forming a conductor there.
    In one area of the sixth wiring layer 1k, a first circuit wiring conductor 3 for circuit wiring the first oscillation circuit 2 is provided. The first circuit wiring conductor 3 includes grounding conductors 3a and 3b, wiring conductors 3c and 3d, and the like. The first circuit components 2a, 2b, and 2c constituting the first oscillation circuit 2 are mounted, and are suitably connected to these grounding conductors 3a and 3b, the wiring conductors 3c and 3d, and the like.
    On the other hand, in the other area | region in the 6th wiring layer 1k, the 2nd circuit wiring conductor 5 for circuit wiring the 2nd oscillation circuit 4 is provided. The second circuit wiring conductor 5 includes grounding conductors 5a and 5b, wiring conductors 5c and 5d, and the like. Second circuit components 4a, 4b, and 4c constituting the second oscillation circuit 4 are mounted, and are suitably connected to these grounding conductors 5a and 5b and wiring conductors 5c and 5d.
    In addition, a grounded conductor (first ground conductor) 6 is provided on the entire surface of the first wiring layer lf of the multilayer substrate 1. Among the four wiring layers lg, 1h, 1i, and lj provided in the inner layer, the second ground conductor 7 is provided almost all over the third wiring layer lh, and almost entirely in the fifth wiring layer lj. A third ground conductor 8 is provided over. In addition, a first microstrip line 9 serving as a first resonance line is provided in the fourth wiring layer li, and a second microstrip line 10 serving as a second resonance line is provided in the second wiring layer 1g. . As a result, the second microstrip line, the second ground conductor 7 and the first micro are sequentially arranged in three adjacent wiring layers, that is, the second wiring layer 1g, the third wiring layer lh, and the fourth wiring layer li. The strip line 9 is provided and is electrically sealed between the second first microstrip line 9 and the second microstrip line 10 by a second ground conductor 7. The first microstrip line 9 is provided between the second ground conductor 7 and the third ground conductor 8, and the second microstrip line 10 is formed of the first ground conductor 6 and the first ground conductor 6. 2 will be installed between the ground conductor (7).
    On both sides of the multi-layer substrate 1, a connecting conductor ll and a second oscillating circuit connected to one grounding conductor 3a of the first circuit wiring conductor 3 on the side of the first oscillation circuit 2 are formed. A connecting conductor 12 connected to the grounding conductor 5a of one of the second circuit wiring conductors 5 on the side of (4) is formed so that the first grounding conductor 6, the second grounding conductor 7, The third ground conductor 8 is connected to these connecting conductors 11 and 12. In addition, the first ground conductor 6 and the second ground conductor layer 7 are formed in the multi-layer substrate 1 by the conductive holes 13 passing through the first insulator layer 1a and the second insulator layer 1b. And the second ground conductor 7 and the third ground conductor layer 8 are connected to each other in the multi-layer substrate by conductive holes 14 penetrating through the third insulator layer lc and the fourth insulator layer 1d. l) are connected to each other within. In addition, the third ground conductor 8 is formed of the first circuit wiring conductor on the side of the first oscillation circuit 2 in the multilayer substrate 1 by the through holes 15 and 16 formed in the fifth insulator layer le. The other grounding conductor 3b of 3) and the second grounding conductor 5b of the second circuit wiring conductor 5 on the side of the second oscillation circuit 4 are connected.
    FIG. 2 is a perspective view showing the configuration of the first microstrip line 9 and the second microstrip line 10, the first microstrip line 9 being shown together with the third insulator layer 1c, and the second microstrip line 9. The stripline 10 is marked with the first insulator layer 1a. The first microstrip line 9 and the second microstrip line 10 are formed in an E-shape, for example. That is, the outer track conductors 9d and 9e are provided on both sides of the center conductor line 9c in the first microstrip line 9, and the first terminal portion 9a and the second terminal portion at their ends. (9b) is formed. One end side of the center line conductor 9c and one end side of the outer line conductors 9d and 9e are connected by the connecting line conductor 9f to form an E shape. In addition, the outer line conductors 10d and 10e are also provided at both ends of the center conductor line 10c in the second microstrip line 10, and the first terminal portion 10a and the second terminal portion are provided at their ends. (10b) is formed. One end side of the center line conductor 10c and one end side of the outer line conductors 10d and 10e are connected by a connecting line conductor 10f to form an E shape.
    Then, the first oscillation circuit 2 is formed by the through hole 17 through which the first terminal portion 9a of the first microstrip line 9 passes through the fourth insulator layer 1d and the fifth insulator layer le. It is connected to one wiring conductor 3d of the 1st circuit wiring conductor 3 of the side, and the 2nd terminal part 9b passes through the through hole l4, the 2nd ground conductor 7 and the 3rd ground conductor 8 ) Is connected.
    Similarly, the first terminal portion (Oa) of the second microstrip line 10 is the second insulator layer (1b), the third insulator layer (1c), the fourth insulator layer (1d) and the fifth insulator layer (le) The through hole 18 penetrates to one of the wiring conductors 5c in the second circuit wiring conductor on the side of the second oscillation circuit 4, and the second terminal portion 10b passes through the through hole 13 and is formed. The first ground conductor layer 6 and the second ground conductor layer 7 are connected.
    As a result, the first microstrip line 9 constitutes the first oscillation circuit 2 together with the first circuit parts 2a, 2b, 2c, etc., and the second microstrip line 10 includes the second circuit part ( 4a, 4b, 4c, etc., the 2nd oscillation circuit 4 is comprised. For example, the oscillation frequency of the first oscillation circuit 2 is set to be higher than the oscillation frequency of the second oscillation circuit 4. Therefore, the line length between the 1st terminal part 9a and the 2nd terminal part 9b in the 1st microstrip line 9 is the 1st terminal part 100a and the 1st terminal part in the 2nd microstrip line 10o. It is set shorter than the length of the line between the two terminal portions 10b.
    As shown in FIG. 3, a plan view when the first microstrip line 9 and the second microstrip line 10 overlap each other, a part of the first microstrip line 9 and the second microstrip line 10 are shown. Are overlapped with each other, the other part of the first microstripline 9 does not overlap the second microstripline, and the other part of the second microstripline 10 does not overlap the first microstripline 9. It is supposed to be. That is, the track conductor 9c at the center of the first microstrip line 9 and the track conductor 100 at the center of the second microstrip line 10 overlap each other. In addition, the outer line conductors (10O, 10O) in the second microstrip line (10), the first terminal portion (10a) and the second terminal portion (10b) at their ends are respectively the first microstrip line (9). Since it is located outward from the track conductors 9e and 9d on the outer side, the length of the track of the first microstrip line 9 does not overlap the first microstrip line 9, and thus the second microstrip. It is shorter than the track length of the line 10.
    Moreover, the outer track conductor 9d in the first microstrip line 9 and the first terminal portion 9a at its tip are the inner track conductor 10c in the second microstrip line 10. Since it is provided so that it may be located between and the outer track conductor 10e, it does not overlap with the 2nd microstrip line 10, and similarly, the outer track conductor 9e in the 1st microstrip line 9 is similar. And the second terminal portion 9b at the tip end thereof is disposed between the inner line conductor 10c and the outer line conductor 10d in the second microstrip line 10, It does not overlap with the stripline 10.
    For this reason, when connecting the 1st terminal part 9a of the 1st microstrip line 9 to the wiring conductor 3d of the 1st oscillation circuit 2, the 2nd terminal part 9b is connected to the 1st ground conductor 6 When connecting to any one of the third to third ground conductors 8, the first terminal portion 10a of the second microstrip line 10 is connected to the wiring conductor 5c of the second oscillation circuit 4. In this case, the first microstrip line 9 and the second microstrip line 10 may be used to connect the second terminal portion 10b to any one of the first ground conductor 6 to the third ground conductor 8. ) Are not interfered with each other, so that the above connection is simplified.
    In addition, the multi-layer substrate 1 has the first circuit components 2a, 2b, 2c constituting the first oscillation circuit 2 and the second circuit components 4a, 4b, 4c constituting the second oscillation circuit 4. The metal cover 19 is installed to cover the.
    In the adjustment of the oscillation frequency of the first oscillation circuit 2 and the oscillation frequency of the second oscillation circuit 4, by irradiating a laser beam from the lower surface side of the multilayer substrate 1, the first ground conductor 6, First insulator layer 1a, second microstrip line 10, second insulator layer 1b, second ground conductor layer 7, third insulator layer lc, first microstrip line 9 Install the notch grooves 41 at the same time. At this time, the laser beam is irradiated from the connecting line conductors 9f and 10f side and moves along the center line conductors 9c and 10c. Then, the first microstrip line 9 and the second microstrip line 10 are trimmed to lengthen the line length, and the oscillation frequencies of the first oscillation circuit 2 and the second oscillation circuit 4 are close to a predetermined frequency. Go.
    When the oscillation frequency of the first oscillation circuit 2 is adjusted to a predetermined frequency, the output of the laser beam is lowered so that the first ground conductor 6, the first insulator layer la, and the second microstrip line 10 are lowered. Only to install the notch groove 42 in succession. As a result, the laser beam trims the second microstripline 10 to further lower the oscillation frequency of the second oscillation circuit.
    As described above, the second microstrip line 10 connected to the second oscillation circuit 4 having the lower oscillation frequency is provided in the wiring layer (second wiring layer lg) outside the first microstrip line 9. The oscillation frequency can be adjusted at the same time.
    The voltage controlled oscillator of the present invention forms a ground conductor on almost the entire surface of the intermediate wiring layer among at least three adjacent wiring layers, and forms a first resonance line in one wiring layer adjacent to the intermediate wiring layer, Since the second resonance line was formed in the other wiring layer adjacent to the wiring layer of the first and second resonance lines in the vertical direction, the two voltage controlled oscillators could be formed even if the area of the multilayer board was reduced. Can be.
    In the voltage controlled oscillator of the present invention, since the first resonant line has a terminal portion connected to the first oscillation circuit, and the terminal portion does not overlap the second resonant line, the voltage controlled oscillator connects the first resonant line to the first oscillation circuit. In this case, the first oscillation circuit can be connected without bypassing the second resonance line. Therefore, the size can be further reduced.
    In the voltage controlled oscillator of the present invention, since the second resonant line has a terminal portion connected to the second oscillation circuit, and the terminal portion does not overlap the first resonant line, the voltage resonant line is connected to the second oscillation circuit. In this case, the second oscillation circuit can be connected without bypassing the first resonance line. Therefore, the size can be further reduced.
    The voltage controlled oscillator of the present invention has the oscillation frequency of the first oscillator circuit higher than the oscillation frequency of the second oscillator circuit so that the second resonance line is provided on the side opposite to the upper surface side of the multilayer substrate with respect to the first resonance line. The oscillation frequency of the first oscillation circuit can be adjusted by trimming the first resonance line and the second resonance line simultaneously in one continuous process, and then the oscillation frequency of the second oscillation circuit can be adjusted continuously. do. Therefore, the process of adjusting the oscillation frequency is reduced.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] A multilayer board having at least three adjacent wiring layers in an inner layer, a circuit component provided on an upper surface of the multilayer substrate, and a resonance line formed in the wiring layer, wherein the circuit component comprises a first circuit constituting a first oscillation circuit; And a second circuit component constituting the second oscillation circuit, wherein the resonance line includes a first resonance line constituting the first oscillation circuit like the first circuit component, and the second circuit component like the second circuit component. A second resonant line constituting the oscillation circuit, a grounding conductor is formed on almost the entire surface of the intermediate wiring layer in the wiring layer, and the first resonance line is formed in one wiring layer adjacent to the intermediate wiring layer; And forming the second resonance line in the other wiring layer adjacent to the intermediate wiring layer so that a portion of the first resonance line and a portion of the second resonance line are in the vertical direction. Voltage controlled oscillator, characterized in that overlapping.
    [2" claim-type="Currently amended] The method of claim 1,
    And the first resonant line has a terminal portion connected to the first oscillation circuit, and the terminal portion does not overlap the second resonant line.
    [3" claim-type="Currently amended] The method of claim 1,
    And the second resonant line has a terminal portion connected to the second oscillating circuit, and the terminal portion does not overlap the first resonant line.
    [4" claim-type="Currently amended] The method of claim 1,
    The second resonance line is provided on the side opposite to the upper surface side of the multilayer board with respect to the first resonance line by setting the oscillation frequency of the first oscillation circuit higher than that of the second oscillation circuit. Controlled oscillator.
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    同族专利:
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    KR100321334B1|2002-03-18|
    JP2000151276A|2000-05-30|
    JP3604925B2|2004-12-22|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-11-12|Priority to JP32232798A
    1998-11-12|Priority to JP10-322327
    1999-11-11|Application filed by 가타오카 마사타카, 알프스 덴키 가부시키가이샤
    2000-07-25|Publication of KR20000047619A
    2002-03-18|Application granted
    2002-03-18|Publication of KR100321334B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP32232798A|JP3604925B2|1998-11-12|1998-11-12|Voltage controlled oscillator|
    JP10-322327|1998-11-12|
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